电子封装失效分析开课了+上海耀谷

失效分析 Failure analysis 常用失效分析流程和工具 Failure analysis and tools 1天 mike提供 1day · 失效定义及分类 Definition and classification of failures · 电子产品为何失效 Why do electronic products fail? · 失效分析的目标 The objectives of failure analysis · 失效分析的重要性 Understand the importance of failure analysis · 失效分析的思想方法 Philosophical approach of failure analysis · 失效分析技术线路 Technique approach of failure analysis · 失效分析流程 Failure analysis flow charts · 常用失效分析无损检测工具 Nondestructive analysis tools for failure analysis · 常用失效分析物理解剖和定位工具Destructive analysis tools and failure isolation tools 失效分析 Failure analysis 电子封装失效分析 Electronic package and failure analysis 0.5天 0.5 day · 失效定义及分类 Definition and classification of failures · 电子产品为何失效 Why do electronic products fail? · 失效分析的目标 The objectives of failure analysis · 失效分析的重要性 Understand the importance of failure analysis · 失效分析的思想方法 Philosophical approach of failure analysis · 失效分析技术线路 Technique approach of failure analysis · 失效分析流程 Failure analysis flow charts · 解决问题的8D方法 Eight disciplines (8D) in problem solving · 元器件典型失效模式和机理 Typical failure modes and failure mechanisms of electronics components · 典型封装产品失效分析案例 Case study for electronic package failure analysis 失效分析 Failure analysis Soldering & Solder Joint Failure Analysis 焊接及焊点失效分析 0.5 天 0.5 day · 失效定义及分类 Definition and classification of failures · 电子产品为何失效 Why do electronic products fail? · 失效分析的目标 The objectives of failure analysis · 失效分析的重要性 Understand the importance of failure analysis · 失效分析的思想方法 Philosophical approach of failure analysis · 失效分析技术线路 Technique approach of failure analysis · 失效分析流程 Failure analysis flow charts · 解决问题的8D方法 Eight disciplines (8D) in problem solving · 焊点失效分析流程 Typical flow chart for solder joint failure analysis · 焊点失效典型模式及分析方法 Typical failure modes and analysis method · 典型焊点失效分析案例 Case study for solder joint failure analysis