电子封装可靠性培训班的通知

目录 Catalog 培训内容/时间 Course Title 课程内容 Content 可靠性 Reliability 可靠性、质量认证及测试 Reliability, Qualification and test 0.5 天 0.5 day · 微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems · 可靠性描述和浴盆曲线 Reliability description and bathtub curve · 常见可靠性模型和加速因子估算 Common reliability model and active factor estimation · 可靠性试验和认证 Typical reliability tests · 器件结构分析 Package construction analysis 可靠性 Reliability 塑料封装器件的潮气敏感性及相关问题 Moisture Sensitivity and Relevant Issues 0.5 天 0.5 day · 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc. · 器件湿气敏感性分级：JESD020: 非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices · 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？How to judge the root cause when popcorn crack happens: device quality or SMT problem? · 器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide mike提供