FA可靠性培训

目录 Catalog 培训内容/时间 Course Title 课程内容 Content 可靠性 Reliability 可靠性、质量认证及测试 Reliability, Qualification and test 0.5 天 0.5 day • 微电子器件及微系统简介Brief introduction of microelectronic devices and micro-electronic systems • 可靠性描述和浴盆曲线 Reliability description and bathtub curve • 常见可靠性模型和加速因子估算 Common reliability model and active factor estimation • 可靠性试验和认证 Typical reliability tests • 器件结构分析 Package construction analysis 可靠性 Reliability 塑料封装器件的潮气敏感性及相关问题 Moisture Sensitivity and Relevant Issues 0.5 天 0.5 day • 塑料封装器件中的水汽扩散、回流焊接过程中湿气蒸发引起的分层、爆裂等失效现象 Moisture diffusion in plastic packages, moisture induced failure modes such as delamination, popcorn crack, etc. • 器件湿气敏感性分级：JESD020: 非气密性表面封装固态电路的水汽/回流敏感性等级 Moisture sensitivity level: JESD020: Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices • 如何判断与湿气敏感性相关的失效的根本原因：器件质量还是电子组装？How to judge the root cause when popcorn crack happens: device quality or SMT problem? • 器件怀疑吸湿如何处理：实用指南 What to do, if your devices are susceptible of excessive moisture absorption: a practical guide 可靠性 Reliability 电子器件静电防护和过电损伤 ESD and EOS 0.5 天 0.5 day • 静放电/电过应力基本概念介绍 ESD/EOS definition and distinguish • 器件/系统静放电评估和实验方法 Component level ESD while system level ESD evaluation and test • 静放电控制和检查 Typical ESD control and checklist in manufacture process • 电过应力预防和根因分析难点 Typical EOS prevention and challenge of root cause identification • 典型案例 Case study 可靠性 Reliability 器件焊接性能评价方法及标准 Test method and standard for component solderability evaluation 0.5 天 0.5 day • 无铅焊相关的常见标准 Common standards for lead free soldering • 无铅焊的润湿性评价试验 Solderability tests and evaluation for lead free soldering • 无铅焊点强度试验方法 Testing of solder joint strength for lead free soldering • 无铅焊点寿命机械试验方法 Lead free solder joint lifetime test with mechanical method